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| BAS116 SURFACE MOUNT LOW LEAKAGE DIODE Please click here to visit our online spice models database. Features * * * Surface Mount Package Ideally Suited for Automated Insertion Very Low Leakage Current Lead Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4) Mechanical Data * * * * * * * * * SOT-23 Case: SOT-23 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminal Connections: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Polarity: See Diagram Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.008 grams (approximate) TOP VIEW TOP VIEW Internal Schematic Maximum Ratings @TA = 25C unless otherwise specified Symbol VRRM VRWM VR VR(RMS) IFM IFRM @ t = 1.0s @ t = 1.0ms @ t = 1.0s IFSM Value 85 60 215 500 4.0 1.0 0.5 Unit V V mA mA A Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 1) Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current Thermal Characteristics Characteristic Power Dissipation (Note 1) @TA = 25C Thermal Resistance Junction to Ambient Air (Note 1) @TA = 25C Operating and Storage Temperature Range Symbol PD RJA TJ, TSTG Value 250 500 -65 to +150 Unit mW C/W C Electrical Characteristics Characteristic Reverse Breakdown Voltage (Note 2) Forward Voltage @TA = 25C unless otherwise specified Symbol V(BR)R VF Min 85 Typ Max 0.90 1.0 1.1 1.25 5.0 80 3.0 Unit V V nA nA pF s Test Condition IR = 100A IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, Tj = 150C VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100 Leakage Current (Note 2) Total Capacitance Reverse Recovery Time Notes: IR CT trr 2 1. Part mounted on FR-4 PC board with pad layout as shown on page 3. 2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead. Halogen and Antimony Free. 4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. BAS116 Document number: DS30233 Rev. 9 - 2 1 of 3 www.diodes.com May 2008 (c) Diodes Incorporated BAS116 300 PD, POWER DISSIPATION (mW) 250 300 RJA = 500C/W 250 IF, FORWARD CURRENT (mA) Note 1 200 200 150 150 100 100 50 50 0 0 50 100 150 TA, AMBIENT TEMPERATURE (C) Fig. 2 Current Derating Curve 200 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (C) Fig. 1 Power Derating Curve 150 IF, INSTANTANEOUS FORWARD CURRENT (mA) 1,000 10 VR = 75V 100 10 T A = 150C IR, REVERSE CURRENT (nA) 1 T A = 125C 1 T A = 85C TA = 25C 0.1 0.01 0.001 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 3 Typical Forward Characteristics 0.1 0 50 100 150 TA, AMBIENT TEMPERATURE (C) Fig. 4 Typical Reverse Characteristics 200 Ordering Information Part Number BAS116-7-F Notes: (Note 5) Case SOT-23 Packaging 3000/Tape & Reel 5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information XXX = Product Type Marking Code; K50, K54 YM = Date Code Marking Y = Year ex: N = 2002 M = Month ex: 9 = September XXX Date Code Key Year Code Month Code 2001 M Jan 1 2002 N Feb 2 2003 P Mar 3 2004 R Apr 4 2005 S May 5 YM 2006 T Jun 6 2007 U Jul 7 2008 V Aug 8 2009 W Sep 9 2010 X Oct O 2011 Y Nov N 2012 Z Dec D May 2008 BAS116 Document number: DS30233 Rev. 9 - 2 2 of 3 www.diodes.com (c) Diodes Incorporated BAS116 Package Outline Dimensions A TOP VIEW BC G H K M J D F L SOT-23 Dim Min Max A 0.37 0.51 B 1.20 1.40 C 2.30 2.50 D 0.89 1.03 F 0.45 0.60 G 1.78 2.05 H 2.80 3.00 J 0.013 0.10 K 0.903 1.10 L 0.45 0.61 M 0.085 0.180 8 0 All Dimensions in mm Suggested Pad Layout Y Z C Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35 X E IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. BAS116 Document number: DS30233 Rev. 9 - 2 3 of 3 www.diodes.com May 2008 (c) Diodes Incorporated |
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